Sputtering Fabrication Services

• Thin film HMC fabrication facility with physical deposition of metals and semiconducting materials

• Three target sputtering machine with capability of 4”x4” square substrates 4 at a time.

• Presently have SiChrome, Titanium and Copper as three targets

• Can deposit Chromium, Nickel, Gold, Silver, Aluminum, Tungsten, Molybdenum and many others

• Simultaneous and sequential deposition of any above material is possible

• Substrate heating up to 400°C is possible

• Also useful for high temperature vacuum backing